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PHOCUS on reservoir computing
Inspired by the fast processing of information in the human brain, a consortium of European research institutions is developing a novel kind of computing. The EU funded project “PHOCUS” started in January aims at designing photonic systems, communicating via light, to quickly perform complex computations including the rapid processing of large amounts of data, potentially consuming far less power than current supercomputers.
Photovoltaics & batteries: new routes
Two solar research projects in which Edinburgh and Strathclyde University have parts will have a cast of 46 players in both UK and India covering excitonic cells and PV stability. It is against a background where IBM opts for 'earth abundance,' Mitsubishi pushes polysilicon solar as well as a new battery for the thriving Japanese solar batteries business.
EU DIAMOND approach to parallel TRAMS
A three year project, running alongside TRAMS, aims to focus on improved productivity and reliability of semiconductor and electronic design, with IBM research to collaborate with seven other members in the DIAMOND ( Development of an Innovative, Accurate, Monolithic New Design?) consortium to create significant savings on chips and cut design time .
Glasgow plays key EU role in TRAMS
Glasgow University led by Professor Asen Asenov, of the Department of Electronic and Electrical Engineering, will play a key role in a prestigious European task force teamed up to investigate how to design the next generation of tera-scale computer memory systems
Simulation for power & heat transfer
CD Adapco offers a free event on simulation (CFD/CAE), new methods & applications for Electronics Thermal Management. 1-day class includes tips for simulating electronic systems without compromising geometry detail or the physics of a problem.
Atom-scale Silicon Hybrid Nanotechnologies
The international Symposium will will discuss emerging silicon-based nanotechnologies for advanced information & communication devices being lighter, more functional and more economical.
Sheep get electronic ID funding
NFU Scotland has welcomed the Scottish Government’s financial support for farmers making the switch over to electronic identification (EID) in sheep where it will help to fund the cost of the new tags and the purchase of reading equipment and management software for farmers using the technology.
Dry-etch recipe for diamond devices
Advanced Diamond Technologies (ADT) is making broadly available an etch recipe which enables engineers and product developers to reliably and affordably design micro devices and sensors out of diamond.
Fast Alzheimer's analysis method
VTT Technical Research Centre of Finland has developed a method for analysing MR images in just a few minutes when diagnosing Alzheimer's disease. The accuracy of the analysis Fast and robust multi-atlas segmentation of brain magnetic resonance images is comparable to manual measurements made by skilled professionals, currently considered the most reliable method for diagnosing Alzheimer's and is also well suited for clinical use.
Apple dual sources: Intel focus on software
Speculation has it that a new hybrid phone from Apple is likely to be build by Pegatron and not by Apple's current EMS-partner Foxconn, while the chip giant Intel turns its focus on the Atom Developer Program Software Development Kit.
Wolfson responds and anticipates
Wolfson Microelectronics launches three products in February. These are the myZone WM182, an stereo ear-bud headset reference solution, with feed-forward Ambient Noise Cancellation (ANC) technology in a mass-market headset responding to customer requests; the world’s first digital audio hub solution for mobile phones has emerged as the WM8995 and the audio amplifier portfolio widens with the WM9090 and the WM9010 for the world’s most highly integrated mobile phones.
Will robotic Valentines appeal?
Gaberlunzie was amused by one Valentine suggestion of Hexbugs and is considering whether the top of the range inchworm, or more limited crab, ant or nano would be most appealing to someone who loathes spiders! He reckons the original Hexbug should be avoided in this case.
Skins to power and display
Two companies, US PowerFilm subsidiary Phicot and a Portugese company Displax are producing new polymer skins interfaces. In Phicot's case the skin is adapted from existing a cheap silicon solar cells embedded in printed polymer process, while Displax has based its polymer around capacitive technology on a thinner than paper film that turns glass, plastic, wood or curved surfaces into an interactive touch screen display.
CMP and Evatronix collaborate on IP cores
Silicon intellectual property provider, Evatronix SA of Polland and Circuits Multi Projects (CMP) France are in collaboration and development of an educational programme, including the distribution of the large portfolio of Evatronix IP for Universities and research laboratories.
Wolfson partners for distribution and adds product
Wolfson Microelectronics has been busy on both product and distribution fronts. It has signed a franchise agreement with Future Electronics of Montreal, Canada as its primary global distributor and launched WM8912, another ultra low power DAC in its portfolio.
Materials team with fabricators for illumination
Materials specialist team up with fabrication facilities as French Soitec Group, lead supplier of silicon-on-insulator (SOI) and other engineered substrates signed an agreement with Israel based TowerJazz semiconductor fab. The deal enables a turn-key solution for high-end backside illuminated (BSI) CMOS image sensors (CIS) for industrial, medical and automotive applications
Graphene submits to wafers
Back in November Fujitsu Laboratories developed technology that allowed for graphene to be formed on insulating film substrate via CVD at the low fabrication-temperature of 650°C, enabling graphene-based transistors to be directly formed on the entire surface of substrates. Although the test substrate employed was a 75-mm silicon substrate (wafer) with oxide film, the new technique is applicable to larger 300-mm wafers as well.
Smart dust sensing hinges on smart power
Power consumption has long been the Achilles’ heel of sensor-based computing. Smart dust, observed Joshua Smith, a principal engineer at Intel Labs in Seattle, proved impossible because the clever sensors needed batteries. Instead of dust, he said, the sensor nodules would be the size of grapefruits. But it appears the smart nuclear battery is under development at Missouri
University.
Start-up creation of microsystems
A course designed to give student, engineers and business owners a thorough introduction to the realities of developing and marketing new electronics applications and devices, conducted by the Swiss Foundation for Research in Microtechnology (FSRM) is to being hosted 0n 29th March by the Edinburgh based Institute for System Level Integration (iSLI).
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