The ability to move a finished circuit onto another carrier without jeopardizing yield opens new doors for designers enabling the production of high-end image sensors;  soon enabling a range of new photonics applications, RF circuits, and the ultimate realisation of more complex 3D product architectures. To decouple circuit fabrication from application needs, Soitec developed this generic process to transfer thin layers of processed wafers onto a variety of materials. 

Smart Stacking technology comprises low-temperature, high-energy wafer bonding, and thinning techniques, both enhanced by Soitec’s high volume production know-how. The company reports that several wafer types coming from a number of worldwide foundries and IDMs have been successfully processed for prototyping and production in its state-of-the-art manufacturing line.

“As a substrate manufacturer with world-class industrial capabilities, validated IP and many years of experience, Soitec is offering Smart Stacking circuit stacking technology using a unique approach,” notes Bernard Aspar, vice-president of the Tracit business unit.

“For lower volume applications, we can provide circuit stacking custom manufacturing services, but we recognise that higher volume applications may be served best by transferring a customised process to our customers, giving them opportunities to simplify their logistics, reduce costs and shorten cycle times.  Therefore we provide both manufacturing service and technology licensing options.”

The Soitec Group acquired Tracit (originally a spin-off of the famous CEA-Léti microelectronics research organisation) in 2006. Today’s announcement validates this strategic, highly-complementary acquisition, as well as the Group’s overall strategy of volume manufacturing, licensing and innovation through the development of breakthrough technologies.

According to a recent study on 3D ICs by market research analysis company Yole Development, the demand for wafer-level transfer processing is forecasted to reach significant volume production by 2010/2011, mainly driven by image sensor applications.

“By 2012, when the market for 3D integration of heterogeneous components such as memories, logic, power ICs and analog takes off, Soitec’s circuit stacking technology will enable further device design simplification and manufacturing with hybrid function capability and technology integration,” says Dr. Eric Mounier, co-founder of Yole Development.

Soitec